On Friday January 19, 2024, Cambodia Securities Exchange (CSX) and TELCOTECH LTD. co-hosted the official bond listing ceremony presided over by H.E. Dr. Hean Sahib, Secretary of State of the Ministry of Economy and Finance and Chairman of the Cambodia Securities Exchange. The corporate bond, known as the "Telcotech Public Bond," is guaranteed by the Credit Guarantee and Investment Facility (CGIF) with the total issuance size of approximately KHR 82.08 billion (equivalent to USD 20 million), coupon rate term SOFR+2.5% per annum and a five-year maturity date (2023-2028).
